3D Multilayer Integration and Packaging on Organic/Paper Low-cost Substrates for RF and Wireless Applications

In this paper, solutions for developing low-cost 3D multilayer integration and packaging on the organic substrate Liquid Crystal Polymer (LCP) and the paper substrate have been presented. The key components in RF wireless applications, namely dual band filters, dual-frequency/dual-polarization microstrip antenna arrays and an RFID tag have been designed and fabricated. Test results of the structures show good agreement between the simulation and measurement over their respective bandwidths, demonstrating stable performance of the organic/paper substrates.