Interconnection Technologies of Anisotropic Conductive Films and Their Application to Flexible Electronics

Anisotropic conductive films (ACFs) consist of conducting particles and adhesive resins and have been widely used for packaging technologies in FPDs (Flat Panel Displays) such as LCDs (Liquid Crystal Displays) for last decades. So far various packaging technologies such as TCP (Tape Carrier Package) on LCD panel or PWB (Printed Wiring Board), COF (Chip on flex) on LCD panel or PWB and COG (Chip on Glass) using ACFs have been developed to meet the requirement of fine pitch capability and make the flat panel displays smaller, lighter and thinner. Also ACFs are flip-chip technologies have been of much interest because they provide higher packaging density than conventional semiconductor packaging technologies such as face-up wire bonding. In addition, ACFs are expected as interconnect materials which realize flexible electronics such as flexible display and RFID (Radio Frequency Identification).