1.3–1.55-$\mu$ m CMOS/InP Optoelectronic Receiver Using a Self-Aligned Wafer Level Integration Technology

A heterogeneous 10-Gb/s 1.3- to 1.55-mum optoelectronic receiver is designed and fabricated using a complementary metal-oxide-semiconductor transimpedance amplifier and an InGaAs-InP PIN (p-type, intrinsic, n-type diode) photodiode. The receiver is heterogeneously integrated based on a batch fabrication process which promises low fabrication cost. The receiver measures a transimpedance gain of higher than 50 dBldrOmega over a bandwidth of 6 GHz and demonstrates an open eye diagram with a 1.55-mum 10-Gb/s light source.