Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design

Flexible substrate are gaining more and more in importance in different electronics area. One of the methods to achieve vertical integration within system-in-package (SiP) approach is folding of substrates. The behavior of the folded segments, which are acting as vertical interconnects will be discussed in this paper from geometrical and electrical point of view.