Thin-Film Fine-Pattern Technology for LTCC Multilayer Substrates

The ability to create fine-pattern line widths on LTCC technology substrates, which can be used for high-temperature and high-frequency applications, has been restricted by the limitations of the existing thick-film technology to a practical level of approximately 60 μm line widths; other technologies for finer line widths and spacings are, as yet, experimental in nature. In this study, the use of a thin-film process, which is already used in the mass production of electronic components, is evaluated for use as a fine surface-layer pattern in line widths as small as 15 μm. Such a technology is possible and appropriate when due attention is paid to the chemistry of the process, the use of low-halogen insulation materials, the use of uniform processes, and appropriate washing methods.