57th Electronic Components & Technology Conference

The following topics are dealt with: flip chips; IC interconnections; board level reliability; thermal mechanical loading; radiofrequency components; lead free materials; 3D packaging; copper low k; embedded devices; nanotechnology; advanced substrates; shock vibrations; creep; wafer level packaging; silicon interconnect; solder; microoptical component packaging; radiofrequency modules; polymer composites; MEMS packaging; optical interconnects; system in packaging; package on package; chip scale packaging; bump reliability; electromigration; bioelectronics; flexible electronics.