New Failure Analysis Techniques for Beam Lead and Multi-Level Metal Integrated Circuits

The ultra-sonic probe was invented to go where conventional probes could never go and to do what conventional probes could never do. Special problems related to "isolation cuting" of titanium-platinum-gold interconnects are essentially eliminated. Electrical node probing through deep insulation glass on multi-level metal I/C's is now possible. In addition, the ultra-sonic probe makes possible a new, fast and accurate technique for measuring oxide thickness over selected circuit components. Isolation cutting, electrical node probing and glass thickness measurements are all techniques advanced in the "state-of-the-art" with the application of this new, simple, and low cost instrument.