Calculation of Three-Dimensional Passive Structures Including Bond-Wires, Via-Holes and Air-Bridges using the Spectral Domain Analysis Method

A full-wave analysis method for the investigation of microstrip- and coplanar-structures including bond-wires, via-holes, gate-fingers and air-bridges is presented. For the first time spectral domain analysis technique is used to calculate the S-parameters of real three-dimensional metallization structures. The general formulation and the procedure of the method are described.