MMICs, Modelling, and CAD-Where do we Go from Here?

During the past decade remarkable advances have been made in the integration of microwave circuits on semiconductor chips. This progress could not have taken place without the concomitant advances in the technology of planar circuits, modelling techniques, and computer-aided design (CAD) software. It is evident from developments in the United States and elsewhere that there is an increasing demand for improved circuit performance, higher design accuracy, and greater circuit density on a chip, all with higher yield. Unfortunately, industry's progress in improved device and component modelling, as well as advances in CAD techniques to meet these requirements, have not kept pace. In light of this observation, it is appropriate for us to "take stock" of where we are, where we wish to be in the near future, and what must be done to get there. In general terms, this is the theme of this paper.