A Technique for Die Surface Temperature Measurement of High-Voltage Power Electronic Components using Coated Thermocouple Probes

The performance capabilities of high-voltage high-power systems are significantly impacted by the thermal limitations of power electronic components. To address this issue, numerous current research efforts have been conducted to examine advanced packaging materials and structures as well as novel cooling techniques. Critical to the success of this work is the accurate measurement and characterization of the thermal characteristics of the power electronic components. This paper presents a methodology and assessment of using coated thermocouple probes for measuring the die surface temperature of active high-voltage power electronic components