Application of Time Domain Measurement and Characterization to the Modeling of Leadframes of Plastic Packages for RFIC Devices

This paper presents a time domain measurements and simulation technique for Characterization and modeling of wideband and microwave electronic structures. The technique is successfully applied to the Leadframes of plastic packages for RFIC devices. The modeling process leads to the development of spice-models for the leadframe and wirebonds used in the package and hence enable the designer to improve the circuit performance by considering the packaging effects. Electrical modeling was performed on a 16 lead SOIC plastic package using time domain approach. The developed models have been successfully used by ITT GTC in developing a new generation of power amplifier RFIC's.