A model for verification of coupled high-speed packages and interconnects

A method for verification of the interconnect system design for high-speed and high-density packages is described. To predict design tradeoffs the pertinent parameters are first determined. The electrical behaviors of the interconnects are simulated, and the results of coupling effects are discussed. A new modular SPICE-model has been developed which represents coupled multiconductors. This model can be used to analyze signal distortion and ground-bounce. With this model the SPICE code can be significantly reduced.<
>