Interconnect and output driver modeling of high speed designs

An adaptive Thevenin equivalent circuit model, which can be applied to both emitter follower structured drivers and other unconventional drivers with bootstrap capacitor and overshooting output voltage, and a second order circuit on-chip interconnect approximation make it possible to derive a closed-form analytic expression relating the transient response of the driver to the loading of the interconnect. An efficient and accurate back annotation tool, which predicts interconnect delays to within /spl plusmn/10% of SPICE simulation results, is presented.<
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