High gain AlInAs/GaInAs/InP HEMT's with individually grounded source finger vias

High gain, millimeter wave AlInAs/GaInAs/InP HEMT's with individually grounded source finger vias have been fabricated for the first time using a high resolution Cl/sub 2/:HBr:BCl/sub 3/:Ar RIE process. For comparison of device characteristics at millimeter wave frequencies, HEMT's with end source vias were also fabricated on the same wafer. Fixtured RF characterization has revealed significant reduction in source inductance and reverse transmission in addition to higher gain on devices with individual source vias. These superior RF characteristics exhibited by the HEMT with individually grounded source finger vias illustrate the importance of the via technology for high performance InP-based millimeter wave system applications.<
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