Selection Panel for Reliable Soldering Systems

In order to guarantee a good solder reliability, the choice of soldering partners is crucial. With the on-going reduction of dimension of solder joints, intermetallic phase formation becomes an issue for the long-term-stability. The intermetallics can be mostly observed after soldering. Especially lead-fee solders are well-known for fast reaction by needle-shape forming intermetallics as well as by consumption of solder and metallization. This behavior can be influenced by a combination of soldering partners and soldering parameters. Goal of this presentation is the introduction of a selection panel with the discussion of the intermetallic phase formation for leadfree solders combined with established metallizations