Viscoelastic Characterization of Polymer Matrix of Thermally Conductive Adhesives

The current paper focuses on the viscoelastic behavior of two different epoxy resins which are commonly used as a matrix for thermally conductive adhesives. The paper deals with the characterization of the viscoelastic properties as well as the reaction kinetics and cure shrinkage. Simulation of contact stresses between silver filler particles then showed a large difference in stress relaxation between the two epoxy matrix materials