Optoelectronic Integration for Planar Lightwave Systems in Chip Scale Sensing, Optical Interconnect, and Signal Processing

This paper focuses on the modeling, design, fabrication, and test of planar lightwave structures composed of multiple materials that are integrated together, including passive and active optical components and electronic circuits. The heterogeneous integration of thin film compound semiconductor active devices embedded in passive optical polymer structures will be described. The integration platforms for these structures include Si, Si CMOS, and FR-4 printed wiring boards