DC-50 GHz Low Loss Thermally Enhanced Low Cost LCP Package Process Utilizing Micro Via Technology

This paper describes the design, simulation and measurements of a novel 5times5mm
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surface mount liquid crystal polymer (LCP) package which uses micro vias as a means of signal transition. The new package offers excellent thermal dissipation due to a cavity for device mounting, hence, eliminating the need for thermal vias. For the package design a novel matching technique was developed to match the micro via to 50Omega transmission line. The novel design allowed for a broadband response with 0.3dB of insertion loss and 20dB return loss up to 50GHz. The package achieved 40dB of isolation (after bonding) for a 1.2mm MMIC gap. To obtain accurate package s-parameter measurements a 2-tier calibration procedure was deployed to rapidly extract the package response. Further developments utilizing the good thermal conductivity of the new package technology for high-power LDMOS devices are presented