Considering some undesired effects due to dense packing in supported coplanar waveguide MMICs by using combined methods

Combined methods are used to predict some undesired effects due to dense packing in supported coplanar waveguide monolithic microwave integrated circuits (MMICs). These include the effects due to the presence of an adjacent grounded side wall or the presence of another adjacent line. The presented information can be used to consider these effects during the design stage or to help in designing MMICs in which these effects can be ignored. Numerical results are presented in order to demonstrate these effects.<
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