Micromachined silicon as a module platform for multiple fiber I/Os

Progress toward the implementations of low-cost and reliable multiple optical fiber I/Os (input/outputs) for high-speed optoelectronics modules based on the use of micromachined silicon platforms is described. This approach, which makes use of conventional silicon processing technology, has built-in capabilities for reducing the labor requirements for packaging modules with multiple optical I/Os. In addition, it provides a natural means of extension to the fabrication of multitechnology modules (MTMs) for future-generation microwave systems, antennas, computers, and telecommunications systems. The assembly tolerances that are possible with this technology and the close connection that silicon waferboard has to existing silicon processing technology make it practical module level packaging technology for multiple optical fiber I/Os.<
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