Multi-element multi-layer packaging for phased array antenna applications

The authors describe the design and fabrication of a K/sub a/-band, multilayer, multielement module and present preliminary performance data. This module can be used in advanced phased-array antenna systems. The module makes efficient use of physical volume, and provides reduced interconnect requirements for the array controller. The consolidation of MMIC (monolithic microwave integrated circuit) and ASIC (application-specific integrated circuit) devices into a single package with integral radiating elements has been shown to be feasible. Scattering parameter measurements were made of the module to assess the millimeter-wave performance of the transmission line structures.<
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