Combining new, high-power packages with high-power ICs answers need for hermetic, military motor control electronics

Two high-power hermetic packages have been tooled that offer the combination of increased lead-count and thermal ratings needed to provide military-grade power ICs. This work concerns the two package styles, and the initial high-power motor ICs that utilize them. The first is a 15-lead TO-204 style (formerly called the TO-3), that uses conventional materials, form factor, and manufacturing techniques. The second involves a high-power dual in line pin (DIP) configuration with enhanced heat dissipation (and therefore power handling) capabilities.<
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