Microelectronics manufacturing science and technology (MMST): single-wafer RTP-based 0.35 /spl mu/m CMOS IC fabrication

We have demonstrated the total use of single-wafer processing for fast-cycle-time IC production. Rapid thermal processes have been developed for all the thermal fabrication steps required in two 0.35-/spl mu/m CMOS technologies. Complete CMOS process integration and 3-day CMOS IC manufacturing cycle time have been demonstrated with all-RTP thermal processing.<
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