Approaches to cost reducing MCM-D substrate fabrication

This paper outlines strategies to cost reduce MCM-D substrate fabrication. A simplification of an existing excimer laser via generation process is outlined. The feasibility of using large panel processing equipment borrowed from the LCD industry for the processing of panel sizes up to 500 mm/spl times/500 mm is assessed in a preliminary study, and a cost model is presented. Results presented indicate that significant cost reductions can be obtained in going to LCD panel sizes for MCM-D processing provided volumes are in excess of 250 K 50 mm/spl times/50 mm substrate equivalents per year.<
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