Fabrication issues for free-space optics at the board packaging level

The successful application of optical interconnects to electronic processing systems requires careful consideration of the: electronic system in which it will be used; optical system and electro-optical device performance; electrical-electro optic interface characteristics; packaging of micro optic components and electro-optic devices with electronic substrates; and the reliability of optical interconnects. In addition, the optical system must be performance and cost competitive with advanced electrical connection methods. We consider several of the above issues at the board packaging level, and the design of relevant optical components for these systems.<
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