Via hole, bond wire and shorting pin modeling for multi-layered circuits

This paper presents a full-wave spectral-domain analysis to model generalized three-dimensional circuits for multilayered structures. To describe properly the current along the vertical post, such as via holes, bond wires and shorting pins, etc., the simple pulse function is used in the procedure of the moment method. Several numerical techniques are applied to improve the evaluation of matrix elements. Comparison of numerical results with experimental and available analytical data shows good agreement.<
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