A method to predict cracking in IC plastic packages

We present a method to predict cracking in a model geometry, representing an IC plastic package, under monotonic thermal loading, when no delaminations are present. The results of the analysis are expressed in a dimensionless form so they are generally applicable. A critical relation between the residual stress in the polymer and its tensile strength predicts fracture. Experimental results with a commercial encapsulant show good agreement with the analysis.<
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