Analysis of microwave capacitors and IC packages

This paper presents quasi-static electromagnetic (EM) models for analysis and design of microwave capacitors and integrated circuit (IC) packages. The theoretical background for modeling of open 3-D boundaries with finite difference method (FDM) is reviewed and the use of current simulation method (CSM) for inductance computation is proposed. Computed data for the capacitance and inductance of capacitors with complex three-dimensional geometries are verified both numerically and experimentally, validating the proposed quasi-static models. Numerical results for practical devices and IC packages are also given.<
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