Enhancement of critical current density and reduction of proximity coupling in fine filamentary NbTi with Si and Mn alloyed Cu matrices

Critical current density J/sub c/ and magnetization data are given on fine filamentary NbTi materials with a series of different copper alloy matrices containing Si, Mn, or both. By applying the correct thermomechanical treatment, materials of this type can give high J/sub c/'s with minimal electrical coupling. The use of Si has a particular advantage in that it greatly reduces intermetallic compound formation and may, therefore, obviate the need for a barrier around the filaments under certain conditions.<
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