Automated assembly of new 3D molded interconnection devices

It is pointed out that the assembly of electronic devices is determined by separate construction of flat printed circuit boards with discrete components and insertion in a mechanical unit. New opportunities of integrating housing and circuitry by means of molded interconnects result in new challenges of the insertion technique. Thus, future application-specific industrial robots have to insert components into a housing with three-dimensional circuitry. This also requires new concepts for adhering and soldering. Furthermore, new interconnection technologies have to be included in circuitry structure. The integration of chip on board and multichip techniques require extended insertion systems. The development and testing of these assembly concepts are described.<
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