Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructures

The processing conditions to obtain high-quality and repeatable polysilicon films are described. These include substrate preparation, the deposition procedure, reactor configuration, and postdeposition treatment. Examples of large-aspect-ratio microstructures such as long, thin beams and tuning forms for sensor applications and large-area diaphragms for piezoresistive microphones and X-ray masks are presented to illustrate the potential of polysilicon films that are in tension.<
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