Characterization of the wafer dicing process using Taguchi methodology

The use of Taguch's method of experimental design to characterize the wafer dicing process and improve the yield by reducing backside damage is described. It is shown how the orthogonal array was modified to accommodate mixed levels. Analysis of variance (ANOVA) was used to identify the significant factors. Using the optimum levels of the significant factors resulted in over 85% reduction in scrap, and 60% reduction in dicing process cycle time due to elimination of an inspection operation.<
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