Simulating the dynamic electro-thermal behavior of power electronic circuits and systems

A methodology is presented for simulating the dynamic electrothermal behavior of power electronic circuits and systems. In the approach described, the simulator simultaneously solves for the temperature distribution within the semiconductor devices, packages, and heat sinks (thermal network) along with the currents and voltages within the electrical network. The thermal network is then coupled to the electrical network through the electrothermal models for the semiconductor devices.<
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