Al-plug stacked contact/via process for deep submicron CMOS multilayer metal technology

The authors describe stacked contact/via technology with Al-plug metallization that results in complete filling of submicron contacts and vias of various sizes. The Al-plug process can be done in a conventional sputtering system. Physical and electrical characteristics of the Al-plug process are compared with conventional W-plug process. The implementation of Al-plug technology into submicron integrated circuits is presented.<
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