Equivalent circuit modeling of interconnects from time-domain measurements

A technique for the equivalent circuit modeling of single and coupled uniform and nonuniform interconnects, including discontinuities such as bends and junctions in high-speed circuits and packages, is presented. The circuit models are extracted from time-domain reflection and transmission measurement (TDR/T). The SPICE simulated results for the extracted circuit models for typical single and coupled structures are compared with the measured data to validate the accuracy of the circuit models.<
>