Cost analysis of a high-performance CMOS multichip module

A high-performance CMOS multichip module (MCM) is described, and its evolution from prototype to production part is discussed. The number of suppliers involved and the complications of manufacture are reviewed. The cost evaluation of this high-performance CMOS MCM is tracked and evaluated from prototype to production. The cost analysis includes nonrecurring engineering charges as well as substrate and component costs. The early engineering activities required to produce the prototypes and their associated cost are addressed. The evolution from prototype to production part shows significant cost savings, resulting from the simplification of the design and the component suppliers' efforts to provide TAB (tape automated bonding) devices. Compared to an equivalent discrete board solution, the redesign module represents a 40% cost savings, a size reduction, and a reliability improvement due to design simplification and a reduced parts list. The redesign requires only 18 parts and module assembly. The PC board has been eliminated.<
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