Some alternative substrates and techniques for high power hybrids

The thermal conductivity of substrates is only one of the criteria to be considered when developing high power hybrid applications. The thermal design of assemblies is also under investigation. It has been shown that without adequate mechanical design even the highest thermal conductivity substrate provides little benefit to dissipating power from a particular device. Concepts are being developed to allow appropriate mechanical design of such packages to maximise the benefits of high thermal conductivity substrates.<
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