Microwave module interconnection and packaging using multilayer thin film/thick film technology

A multichip T/R (transmit/receive) module packaging technique that combines thin-film and multilayer-thick-film metallizations on a single alumina substrate with ceramic seal ring technology to provide a high-density, wide-bandwidth, high-performance package is described. A 3.0-6.0-GHz T/R module was designed using this packaging technique. This module contains eight GaAs MMIC (monolithic microwave integrated circuit) chips and four digital GaAs element control interface chips, as well as off-chip matching networks for the power amplifiers and RF bypass capacitors. The resulting T/R module features two independent 16-b receive channels and required only three input voltages and six data and control lines. Prototype units were fabricated with satisfactory results.<
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