A 0.8- mu m CMOS technology for high-performance ASIC memory and channelless gate array

A 0.8- mu m polycide-gate, double-layer-metal CMOS technology is described. Nominal device gate lengths down to 0.8 (+or-0.2) mu m are used for both n- and p-channel transistors. Compact isolation, 175-A gate oxide grown in dry/wet/dry ambient, shallow-junction halo-implanted lightly doped drain n and p devices, TiN contact barrier, and a planarized double-layer-metal process are all integrated and demonstrated with a 0.8- mu m full-CMOS 16K SRAM (static random-access memory) circuit. The device process integrity, design margins, performance, reliability, product yield and speed enhancement are all discussed in detail.<
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