Three-dimensional effects of latchup turn-on CMOS and forward-biased n/sup +/-diode measured by photoemission

Three-dimensional (3-D) effects of latchup and forward currents in scaled n-well CMOS test devices are discussed by comparing the photoemission-intensity analyses with device simulations. For studying 3-D effects in latchup turn-on CMOS devices and forward-biased n/sup +/ diodes fabricated by a scaled n-well CMOS process, photoemission-intensity distributions were measured by using CMOS test device structures with various dimensional n/sup +//p/sup +/-diffusion widths and n/sup +/-p/sup +/ spacings. It was confirmed that total photoemission intensities integrated over the device area were proportional to both supply and forward currents. Spreading distances where the photoemission-intensities decrease to 10% were estimated to be about 8-13 mu m and 34-37 mu m from the n/sup +//p/sup +/ diffusion edges depending on the diffusion widths of 4-40 mu m for the latchup turn-on devices and the forward-biased n/sup +/ diodes, respectively.<
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