Thermal performance of power packages-single-inline package as a case study

The authors focus on the experimental results obtained from thermal resistance measurements made on 23 lead single-in-line (SIP-23) power packages. The experimental techniques employed in making the measurements are reviewed followed by a presentation of the experimental results. A generalized discussion is included of the effects of the various parameters on the package's thermal performance. These results are compared to other similar power packages such as the TO-218 and TO-220 discrete device packages. Some simple empirical models which may be of value to system designers are included.<
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