Development of a high performance air cooled heat sink for multi-chip modules

High-performance inversely trapezoidal heat sinks for multi-chip modules under forced air cooling have been developed by means of thermal simulation. Heat sink specifications were assumed as follows: 60 mm (length)*60 mm (width)*17 mm (height) with less than 0.8 degrees C/W thermal resistance at 3 m/s air velocity. A simple thermal simulation method for a heat sink was first developed to perform thermal flow analysis in the air and heat transfer analysis. The accuracy of this simulation was within +or-20%, and a novel plate-format heat sink with inversely trapezoidal fins has been successfully designed using this simulation.<
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