0.86-nm CET Gate Stacks With Epitaxial$hboxGd_2hboxO_3$High-$k$Dielectrics and FUSI NiSi Metal Electrodes

In this letter, ultrathin gadolinium oxide (Gd
₂
O
₃
) high-k gate dielectrics with complementary-metal-oxide-semiconductor (CMOS)-compatible fully silicided nickel-silicide metal gate electrodes are reported for the first time. MOS capacitors with a Gd
₂
O
₃
thickness of 3.1 nm yield a capacitance equivalent oxide thickness of CET=0.86 nm. The extracted dielectric constant is k=13-14. Leakage currents and equivalent oxide thicknesses of this novel gate stack meet the International Technology Roadmap for Semiconductors targets for the near term schedule and beyond