A general noise de-embedding procedure for packaged two-port linear active devices

A method based on the noise correlation technique and its applications is described. The package, which need not be reciprocal, may consist of an arbitrary interconnection of linear passive elements at thermal equilibrium. Only the terminal admittance properties of the package need be known. However, in certain special cases which lead to singular submatrices of the admittance matrix, the method is inapplicable. This situation can occur when elements such as isolators are part of the package. The necessary theoretical foundation and experimental techniques to enable workers not familiar with the field to assemble the software and laboratory setup for two-port noise de-embedding is provided. The automated noise measurement system used for data acquisition and the mathematical basis for it are described in some detail. The validity of the de-embedding approach is established with extensive experimental data obtained on three MESFETs and a pseudomorphic HEMT.<
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