Improved Dielectric Isolation HVIC Technology (SODI) in Transfer Mold Package

Silicon On Double Insulator (SODI) is a novel and promising technology in order to develop higher breakdown voltage and to reduce cost of dielectric isolation HVIC. First work of SODI is published in 2004, and some improvements have been continued. As a result, a new path has opened that it would be possible to apply the Transfer Mold Package assembly process to SODI with keeping its high breakdown voltage (>800V) easily. By these improvements, we hope that the SODI technology can contribute general purpose motor-drive technology in the application of Intelligent Power Modules (IPMs) . The details of the technical improvements and a Pre-driver SODI-HVIC trial fabrication results are reported in this paper.