Adhesive Bonding Process Development for Planar Lightwave Circuit in Optical Transceiver Assembly

Glass based planar lightwave circuit (PLC) is one of the core components employed in optical transceiver operation. Assembly of PLC onto a silicon optical bench (SiOB) is a crucial step, since it requires actively aligning the PLC to both a laser diode and an optical fiber. We have successfully developed an adhesive bonding process for buried type planar glass wave-guide circuit assembly in optical transceiver packaging with the powerful design optimal experiment tool. A dosage of 280j/cm
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with intensity of 15000mw/cm
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UV curing followed by 15 minutes 110degC thermal cure process is able to achieve 0.2dB optical coupling power loss for PLC-fiber assembly