A creep-rupture model for two-phase eutectic solders

An analytical framework to predict failure of solders under creep conditions is proposed. A creep-rupture model for two-phase eutectic solders, based on both micromechanics and fracture mechanics, has been developed. The general agreement between the model predictions and reported creep-rupture data in the literature for lead/tin eutectic solder indicates that the mode and mechanisms proposed in the model may control the solder creep-rupture process.<
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