Electrical design technology for low dielectric constant multilayer ceramic substrate

The characteristics of a novel packaging substrate are described. Low propagation delay time (3.9 ns/m) can be realized by using a hollow stripline structure ceramic substrate with a 4.4 material dielectric constant. An electric design which can control characteristic impedance and crosstalk coupling noise is realized for the hollow stripline structure. An electric design which can control propagation delay time is realized. Ground plane design which can stabilize the characteristic impedance is realized. As a result, this structure substrate with low dielectric constant shows potential for application on high-speed VLSI packages in the future.<
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