Package technology for STM-16 optical Tx/Rx and IC's

Package technology for STM-16 (2.5 Gbit/s) optical transmitters and receivers is discussed. To obtain high performance and reliability of a laser diode (LD) module, an IC chip, and an LD are assembled contiguously in a non-epoxy hermetically sealed housing separating an epoxy-made optical isolator by a glass window. The LD and a fiber are coupled using laser welding and RF induction heat soldering. To obtain a small degradation caused at the receiver side, ICs are designed to have well-matched characteristics and a flat response. A transmission experiment using modules and ICs developed with these technologies proves their practicality.<
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