Copper polyimide multilayer substrate for high speed signal transmission

Copper-polyimide substrate has been developed for high-speed signal transmission use. This substrate is combined with thick-film cofired technology and thin-film multilayer technology, and it is effective for higher-density packaging use. By using copper-polyimide multilayer substrate with tight tolerance cofired alumina ceramics in conjunction with highly conductive internal metallization, electrical performance in the high-frequency region has been improved. The results of environmental reliability tests and high-frequency evaluations indicate that these products are ready for application.<
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